Fan-Out packaging involves dicing chips on a silicon wafer, and then very accurately positioning the known-good chips on a carrier panel that is molded and followed by an issuing layer atop the molded area
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● STATS ChipPAC
● Texas Instruments
● Rudolph Technologies
● SUSS MicroTec
Geographically, Asia Pacific led the global market. As per the analysts, the region will continue to dominate this market over the forecast period and this will mainly attribute to the availability of key semiconductor industries in the region.
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- 200mm Packaging
- 300mm Packaging
- CMOS Image Sensor
- Wireless Connectivity
- Logic and Memory IC
- MEMS and Sensor
- Analog and Mixed IC
- North America
- South America
- Middle East and Africa
- Latin America
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